SMT fasteners PCB board-level internal thread connection point
1.2mm PCB Internal/External Thread Super Screw
Product photos
Actual photos, not renders

Illustration note
The image shows an actual part of this specification; appearance differs with surface treatment and head style, and the delivered part prevails.
Images are for appearance and structure reference; dimensions and tolerances are subject to the specifications and the applicable standards on this page.
Product description
Compiled from the existing technical description of this product on this site
PCB solder standoffs are made of free-cutting steel or copper alloy, with a tin-plated surface to optimize solderability. A precision locating step at the base supports SMT placement or automated press-fit, forming a stable internal thread on the circuit board and ensuring joint strength and positional accuracy in board-level assembly.
Specifications
The parameters listed on this page are subject to final inspection and the applicable standards; items not listed follow the customer drawing or the order agreement and are not committed by default.
| Material | Free-cutting steel / copper alloy |
|---|---|
| Surface treatment | Tin plating |
| Standard | Per customer drawing / company standard; solderability per IPC/JEDEC J-STD-002; soldering quality per IPC-A-610 |
| Typical application | PCB board-level internal thread connection point |
Spec lookup
Based on your operating conditions, look up directly among the 8 models in this series — pure front-end filtering, no redirects, no URL changes
Filter results are based on the specification fields published on each model page and are for preliminary screening only; the final selection must be confirmed in light of the actual load, plate thickness and assembly process.
Drawings & customization
No public catalogue is available for this series; drawing-based requests are handled per project.
Made to drawing / sample replication
A 2D drawing or a physical sample is enough for evaluation; once confirmed, we issue drawings, build samples and obtain first-article approval before volume production. Drawings and project information are handled under confidentiality requirements.
Manufacturing process
The usual process route for this product family; actual operations follow the drawing and order requirements.
- Precision turning / cold headingPan head and thread forming
- End-face and thread machiningFlatness control of the mounting surface
- ElectroplatingMatte tin / nickel plating, reflow-compatible
- Tape packagingCompatible with SMT placement equipment
- Full inspection of dimensions and platingPlacement and soldering compatibility verification
Capacity & delivery
Taken from the company's published capacity and certification information; no unverified claims are included.
FAQ
Material, standards, surface treatment and installation points for this model; the data comes from the specification table on this page and from the national standards cited in the answers.
Q1What material is the PCB solder standoff made of? What strength level does it achieve?
Materials listed in the specification table on this page: free-cutting steel / copper alloy. Material certificates and mechanical property test reports can be provided with delivery; batch acceptance follows the above specifications.
Q2Which applications is the PCB solder standoff suitable for?
Typical applications listed in the product description on this page: communication and server boards; industrial control and instrumentation panels; power modules; automotive electronics modules. Overview: PCB solder standoffs are made of free-cutting steel or copper alloy, with a tin-plated surface to optimize solderability. A precision locating step at the base supports SMT placement or automated press-fit, forming a stable internal thread on the circuit board and ensuring joint strength and positional accuracy in board-level assembly.
Q3What are the main features of the PCB solder standoff?
Features listed in the product description on this page: locating step at the base for precise placement; tin plating for good solderability and full joints; supports both SMT placement and automated press-fit; forms a stable internal-thread connection point on the PCB.
Q4To which standards is the PCB solder standoff produced and accepted?
Standards listed in the specification table on this page: per customer drawing / company standard; solderability per IPC/JEDEC J-STD-002; soldering quality per IPC-A-610. Dimensional inspection reports can be provided with delivery; batch acceptance is carried out according to the above standards and the drawings agreed by both parties.
Q5How is the solderability of the PCB solder standoff ensured?
Solderability of the tin plating is evaluated per IPC/JEDEC J-STD-002; solder joint appearance and acceptance refer to IPC-A-610. Batch solderability testing is performed with each order to ensure compatibility with reflow and wave soldering. (Applies to this model, the PCB solder standoff.)





